Key Features
- Interference Lens
- Air-Bearing Isolation System
- Sonic Vibration Isolation
- Easy level
- Convenient Joystick
- Vacuum Object Table
Dedicated Functions for Semiconductor Field
- Measure profiles trenches after laser grooving in the dicing process
- Measure film step-height of wafer ranging from 1nm~1mm.
- Measure roughness of silicon cut sheet after grinding process, and can measure dozens of small areas to obtain the average value by one click.
- Support 6″, 8″ and 12″ wafer measurement, and easy switch between 3 sizes of vacuum chucks by one click automatically.
Application
- It is used for measurement and analysis of surface roughness and profile of precision components from industries of semi-conductor, 3C Electronics, ultraprecise machining, optical machining, micro-nano materials, micro-electro-mechanical system
- Measurement and analysis for various products, components and materials’ surface form and profile characteristics, such as flatness, roughness, waviness, appearance, surface defect, abrasion, corrosion, gap, hole, stage, curvature, deformation, etc.
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