PT-Profiler

PT Profilometer Series

Description

Key Features

Interference Lens
Air-Bearing Isolation System
Sonic Vibration Isolation
Easy level
Convenient Joystick
Vacuum Object Table

Dedicated Functions for Semiconductor Field

Measure profiles trenches after laser grooving in the dicing process
Measure film step-height of wafer ranging from 1nm~1mm.
Measure roughness of silicon cut sheet after grinding process, and can measure dozens of small areas to obtain the average value by one click.
Support 6″, 8″ and 12″ wafer measurement, and easy switch between 3 sizes of vacuum chucks by one click automatically.

Application

It is used for measurement and analysis of surface roughness and profile of precision components from industries of semi-conductor, 3C Electronics, ultraprecise machining, optical machining, micro-nano materials, micro-electro-mechanical system
Measurement and analysis for various products, components and materials’ surface form and profile characteristics, such as flatness, roughness, waviness, appearance, surface defect, abrasion, corrosion, gap, hole, stage, curvature, deformation, etc.